NXP RW610FML Module Packs Wi-Fi 6 and BLE 5.4 in 25mm

A Full Wireless Subsystem That Fits Under a Postage Stamp

NXP has launched the RW610FML, a surface-mount wireless module that folds a dual-band Wi-Fi 6 radio, Bluetooth LE 5.4, and a 260 MHz Arm Cortex-M33 application core into a 25.5 x 18 x 3.16 mm LGA package weighing about 1.5 grams. The module is built around the RW610 wireless MCU, and the reason it is interesting is not any single specification but the integration: this is a device where the radio and the application processor are the same part, which removes the host MCU from a huge class of connected product designs.

• 260 MHz Arm Cortex-M33 with TrustZone-M, 1.2 MB SRAM, and 8 MB onboard NOR flash
• Dual-band Wi-Fi 6 (2.4 and 5 GHz, 20 MHz channels, SISO) at up to 114 Mbps peak, plus Bluetooth LE 5.4 with 2 Mbps high-speed mode
• 25.5 x 18 x 3.16 mm LGA module, roughly 1.51 g, rated -40°C to 85°C industrial temperature
• Currently listed as preproduction; the FRDM-RW610FML development board supports FreeRTOS and Zephyr

Why Wi-Fi 6 on a Microcontroller Is Worth Caring About

The peak throughput figure — 114 Mbps on a 20 MHz SISO channel — is not where the value sits, and it would be a mistake to compare it against a laptop's Wi-Fi 6 numbers. What Wi-Fi 6 brings to a microcontroller class device is OFDMA and target wake time. OFDMA lets an access point service many small clients within a single transmission opportunity instead of granting each one the whole channel in turn, which is exactly the traffic pattern a dense deployment of sensors produces. Target wake time lets a battery-powered node negotiate precisely when it needs to be listening, and sleep hard the rest of the time.

Put together, those two features address the failure mode that has dogged Wi-Fi in embedded work for years: a hundred chatty low-rate devices degrading a network built for a handful of high-rate ones. It is the same argument for Wi-Fi 6 that made the LILYGO T-Display C5 board notable earlier this week, arriving here in an industrial-temperature module.

What Interfaces Does the RW610FML Expose?

More than the wireless framing suggests. Alongside FlexSPI for external NOR flash and PSRAM, the module brings out USB, UART, I2C, SPI, and GPIO, plus an LCD display interface and I2S/PCM audio. JTAG and Serial Wire Debug are available for development. That peripheral list is the tell that NXP intends this as the main processor in a product, not a companion radio — an LCD interface and audio path are not things you add to a part meant to sit beside a host MCU.

Security Is Built In Rather Than Bolted On

The RW610FML carries NXP's EdgeLock security subsystem with secure boot and hardware cryptographic acceleration, plus an on-the-fly XIP decryption engine so encrypted code stored in external flash can be executed in place without a decrypt-to-RAM step. Combined with TrustZone-M on the Cortex-M33, that gives designers a credible root of trust on a part small enough for a light switch — which matters increasingly for connected products that need to survive a decade of firmware updates in the field.

Availability and Getting Started

NXP currently lists the RW610FML as a preproduction product and has not announced pricing. Developers who want to start now can use the FRDM-RW610FML development board, which is supported by MCUXpresso IDE, IAR Embedded Workbench, and Keil MDK, with both FreeRTOS and Zephyr available as RTOS options. Zephyr support in particular is a good sign for anyone planning a product that needs a maintained networking stack rather than a vendor SDK fork.

For readers weighing this against other wireless silicon, our low-power wireless MCU guide covers how the nRF54L, ESP32, and RP2350 families compare on power and radio features, and the rest of our mini computer coverage tracks new boards as they land. The RW610FML slots in as the industrial-temperature, security-forward option for teams who need Wi-Fi 6 rather than a low-rate personal-area radio.

Sources: CNX Software — July 29, 2026; NXP — July 2026.