Articles Tagged “System On Module”
9 articles found
Jetway SMC-ARK1 Module Puts 6 TOPS RK3588 on SMARC 2.1
Jetway's SMC-ARK1 packs an octa-core RK3588, a 6 TOPS NPU, and up to 16GB LPDDR4x into an 82x50mm SMARC 2.1 module built for edge AI vision.
NVIDIA Jetson T3000 Packs 865 TFLOPS Into a Tiny Module
NVIDIA's Jetson T3000 delivers 865 FP4 TFLOPS with 32GB LPDDR5X on a 50x87mm module, while the T2000 hits 400 TFLOPS. Both arrive in Q1 2027.
Geniatech XPI-3576-CM5 Packs 6 TOPS Into a CM5 Slot
Geniatech's XPI-3576-CM5 packs a 6 TOPS RK3576 NPU into a 55 x 40 mm module that drops straight into existing Raspberry Pi CM5 carrier boards.
Calixto AM62L STAMP SOM Puts Linux on a Postage Stamp
The Calixto AM62L STAMP SOM fits dual Cortex-A53 cores at 1.25 GHz onto a 40x40 mm module for industrial automation, HMIs, and EV chargers alike.
Forlinx Debuts a Rockchip RK3572 System-on-Module With a 4 TOPS NPU
Forlinx launched the first Rockchip RK3572 system-on-module and dev board — a 4 TOPS NPU, Linux 6.12 BSP, and a tidy platform for edge AI and HMI projects.
Forlinx FET3572-C: First Rockchip RK3572 System-on-Module Ships With Linux 6.12
Forlinx launched the first Rockchip RK3572 system-on-module and OK3572-C dev board on June 4, 2026 — an octa-core edge-AI building block with a 4 TOPS NPU and Linux 6.12 BSP.
Boardcon's PICOT536 SoM and EMT536 SBC Bring 2 TOPS Allwinner T536 Edge AI to Industrial Builds
Boardcon launched the PICOT536 system-on-module and EMT536 SBC on May 4, 2026, pairing the Allwinner T536 edge AI processor with up to 8GB LPDDR4X for industrial HMI and machine vision.
Forlinx UP4 Packs Five Different SoCs Into a 40×40 mm Pin-Compatible System-on-Module
Forlinx Embedded launched the UP4 system-on-module family on April 30, 2026 — five processor variants from NXP, Rockchip, and Allwinner sharing a 40×40 mm pin-compatible footprint for industrial AI and edge computing.
Boardcon Tiny1126B Squeezes AI Vision Into a 34×30mm System-on-Module
Boardcon's new Tiny1126B shrinks its Rockchip RV1126B AI vision module to 34×30mm while adding USB 3.0 and more I/Os — targeting smart cameras, robots, and compact edge AI deployments.