Articles Tagged “Industrial Edge AI”
7 articles found
IBASE AA400-N Packs 256GB DDR5 in a Fanless Box
The fanless IBASE AA400-N pairs AMD Ryzen Embedded 8840U with up to 256GB of DDR5-5600 and 39 TOPS — a rare memory ceiling for silent edge AI boxes.
Advantech AOM-6741 Packs 100 TOPS Into a SMARC Module
The Advantech AOM-6741 SMARC module runs a 100 TOPS Qualcomm Dragonwing IQ-9075 with up to 36GB of LPDDR5 and 16 concurrent camera inputs.
AAEON uCOM-Q6490 Puts 12 TOPS on a SMARC 2.1 Module
AAEON's uCOM-Q6490 packs a Qualcomm Dragonwing QCS6490, 12 TOPS of AI, and up to 16GB LPDDR5 onto an 82x50mm SMARC 2.1 module that weighs just 20 grams.
DFI X6X-ORN Packs 157 TOPS Into an IP67 Edge AI Box
DFI's fanless X6X-ORN pairs an NVIDIA Jetson Orin NX with IP67 sealing, up to 157 TOPS, GMSL2 cameras, four M12 ports and a -20°C to 60°C range.
Forlinx UP4 Packs Five Different SoCs Into a 40×40 mm Pin-Compatible System-on-Module
Forlinx Embedded launched the UP4 system-on-module family on April 30, 2026 — five processor variants from NXP, Rockchip, and Allwinner sharing a 40×40 mm pin-compatible footprint for industrial AI and edge computing.
AAEON's 30mm-Thin BOXER-6407-TWL Puts Fanless Edge AI Into the Tightest Industrial Spaces
AAEON's BOXER-6407-TWL packs Intel Twin Lake, three M.2 slots, and 5G connectivity into a 30mm-thin fanless chassis purpose-built for edge AI and smart manufacturing.
NVIDIA IGX Thor Hits General Availability — Bringing Real-Time Physical AI to Factory Floors and Industrial Edge
The industrial-grade edge AI platform delivers high-speed sensor processing with enterprise reliability and functional safety certifications for manufacturing and robotics deployments.